May 21, 2015 autoseeker reflow optimises reflow profiles with the click of a mouse. For the sn63pb37 and sn62pb36ag2 alloys, the typical profile length is 3. A thermal profile is a complex set of timetemperature data typically associated with the measurement of thermal temperatures in an oven ex. C, 1115 physical properties solder composition sn63 pb37 alloy is the conventional eutectic solder used in most electronic assemblies. Leadfree smt can be challenging however, this challenge can be reduced if the. The post soldering residues of dsp 215d are nonconductive.
Burned pcb with reflow soldering electrical engineering. Adjustments to this profile may be necessary based on specificprocess requirements. By examining the graphic output of the units software, operators can adjust oven parameters to best optimize production and ensure best product quality. Rt04 reflow oven temperature profile recorder is an extremely useful tool for tuning the soldering process of smt boards. Introduction reflow process overview selection of solder paste.
Recommended reflow profile for 63sn37pb or 62sn36pb2ag solder paste. Modifications may be required to fit process and design. To give an indication of a temperature profile in practice, here is a screen shot of the software for the ec reflow mate, with the prescribed profile superimposed. Ep256 has the widest possible reflow processing window. Per package qualification maximum number of reflow can be done on microsemi soc products group packages is 3. With that said, there are certainly instances where fine tuning the reflow profile will benefit. Reflow soldering process considerations for surface mount kemet. The pwi allows users for the first time to compare thermal profile and equipment performance. The conveyor speed was 34 inches per minute and the nitrogen flow was 1500 cubic feet per hour approximately 150ppm o2 concentration.
Reflow the test vehicle was reflowed with a heller 1809exl convection reflow oven. Sn63pb37 or sn62pb36ag02 0 20 40 60 80 100 120 140 160 180 200 220 240 0 30 60 90 120 150 180 210 240 270 300. You need radiation to change temperature as fast as reflow prescribes. This software is required for creating profiles that can be viewed with kics new mobile profile viewer app. The intent is to lower the solder reflow temperature at the converter modules. Some of the latest reflow software reduces the actual number of unique recipes. We tried to run these parts through the normal reflow but found some did not solder well because of insufficient heat in the center of the module group. Sn63pb37 or sn62pb36ag02 0 20 40 60 80 100 120 140 160 180 200 220 240 0 30 60 90 120 150 180 210 240 270 300 time sec. The following is a recommended profile for a forced air convection reflow process. Standard reflow profile for standard and leadfree packages. An optimal reflow profile is one of the most criti cal factors in.
Reflow atmosphere air or n 2 n 2 typically preferred for small components note. So the real trick is to segregate the profiles not the machines. The converter modules are installed after the reflow process. Lead free rework requires a bga camera to determin for sure if you are using the correct profile. Shear testing solder joint strength was tested using an mts 0. An innovative activator system offers excellent wetting in a wide.
The thermal profile is often measured along a variety of dimensions such as slope, soak, time above liquidus tal, and peak. Solder reflow basics introduction electronics assembly is the general term for. The work was started with a reflow profile completed using. Preheat temperature min t smin temperature max t smax time t smin to t smax 150. Sn63pb37 or sn62pb36ag02 time to peak temperature 3. The profile planner is an microsoft excel workbook application that allows you to match solder paste specifications and oven specifications. Users are advised to optimize their own board level parameters to get proper reflow outcome. Solder star, solderstar pro reflow profiler, the solder. Reflow soldering guidelines for surfacemount devices a typical reflow profile from alteras contract manufacturer is shown in figure 2. The impact of reflowing a pbfree solder alloy using a tin.
Solder reflow process use of solder reflow processes can be utilized following the reflow profile of figure 1. I live in the most beautiful place on earth central kentucky. Surface mount technology smt is the electronics assembly process where electrical component leads are joined to the pcb via individual pad connections. A comprehensive suite of full feature software includes profile simulations and integrated spc charting tools.
The superior wetting ability of cr218 results in bright, smooth and shiny solder joints with leaded alloys. For instance, it is widely accepted that 6070% of all solder defects can be traced back to the printer. This document does not provide for any representation or warranty express or implied by nxp semiconductors. Cr218 has been developed to offer excellent wetting, improved printing and to reduce voiding.
Upon receipt of your completed form, you will receive a demonstration license number and download link, which will allow you to install the software. The hybrid industry has used and refined the art of reflow soldering for many years. Go ahead and run a profile and with kics navigator software you will. When the board was properly preheated it would raise the temperature for the actual reflow phase. Sn63 pb37 electropure is a high purity alloy that is composed of 63% tin and 37% lead.
Also ensure drc has been done before design is sent out and checked by board shop. All of the above and thermal profiling is vastly simplified, and an optimal profile can be found in by a minimally trained operator. Reflow soldering profile all information hereunder is per nxp semiconductors best knowledge. The electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow, and reducing bridging during soldering. In this study, ball grid array components with tinsilvercopper sac solder spheres were processed using a tinlead reflow profile and then subjected to thermal cycle testing from 55. As you can see in the image below, i botched the job and burned the solder connections not surprisingly, the board d. Kester r562 type 3 solder paste, sn63 pb37, silver gray, 600g cartridge id. Smt board assembly process intel manufacturing enabling guide 5 march 2016 introduction this chapter addresses the surface mount technology smt board assembly process for reflow soldering smt components to boards, as well as rework soldering for removing and replacing individual components on alreadyassembled boards. If there is no reasonable and feasible reflow soldering process, any process control before said makes no sense. Dec 14, 2018 the first profile was a baseline, and served as a foundation for further profiles to be developed by changing the process window settings. This blog is about hooking stuff up to the internet. I made a homemade reflow oven and used it for the first time to solder a board. This profile is designed for use with sn63 pb37 and sn62pb36ag2 and can serve as a general guideline in establishing a reflowprofile for use with other alloys. Solder reflow basics introduction electronics assembly is the general term for joining electrical components to printed circuit boards pcb.
Standard solder paste reflow profile for kester paste containing alloys. The lead free profile can be 2040 degrees hotter than the tin lead profile so using the tin lead profile for lead free parts will certainly not provide acceptable results. With a special focus on the ecreflowmate from eurocircuits, this article delves into the art and craft of creating reflow solder profiles. It is critical that the filters internal temperature not be permitted to exceed 220c. Different package types have different profiles due to individual device characteristics, especially thermal mass and construction. Standard reflow profile fo r standard and leadfree packages the reflow here in provided is for reference only. Solder profile for lead free reflow process figure 1 classification reflow profile for smt components refer to ipcjedec jstd020e table 1 classification reflow profiles profile feature pbfree assembly average rampup rate t smax to t p 3c second max. Hold for 12 minutes to let the whole board reach the temperature. Sn63pb37 no clean solder paste 4860p technical data sheet. Follow paste manufacturers recommended thermal profile. Capable of multiple reflow profiles before a cleaning operation is. Ep256 is also capable of stencil printing downtimes of up to 90. Reflow profile for sn63 pb37 solder assembly, designed as a starting point for process optimization. In business since 1986, we have acquired expertise in the design and production of electronics and technical software, including embedded systems, graphical applications and system software.
To give an indication of a temperature profile in practice, here is a screen shot of the software for the ecreflowmate, with the prescribed profile. Improving solder paste reflow mike fenner technical manager indium europe march 2010 today heat transfer and equipment how to profile, variables to consider. Reflow soldering is a process in which a solder paste a sticky mixture of powdered solder and flux is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the. Autoseeker reflow thermal profile optimisation software. Recommended reflow profile for 63sn37pb or 62sn36pb2ag. Kic thermal reflow oven profile tools, fixtures, and accessories make it easy to record and store accurate records of your reflow oven temperature profile for each job, shift, sample, or pcb. The post soldering residues of 4860p are nonconductive, noncorrosive and highly insulated. Reflow soldering profile setup and optimisation software solderstar. Smartlink allows high measurement channel configurations, while maintaining a small footprint and connection to a range of accessories for capture of spc information from both reflow and wave soldering processes. Fixtures for the tensile test machine supported the sam.
Taking the pain out of pbfree reflow northtouch canada inc. This profile provides adequate margin to this critical temperature while permitting reflow attachment of the device with sn63 solder or variants. The difference with an oven is that heating was through radiation instead of convection. Use watersoluble, low residue, or noclean solder paste sac alloy or sn63 pb37. Jul 20, 2012 the pwi allows users for the first time to compare thermal profile and equipment performance. Leadfree defects in reflow soldering the ipc610d acceptability of electronic assemblies will shortly be available and section 5. Profile planner reflow profiling software description. There are four stages to the solder reflow profile. Kester r562 type 3 solder paste, sn63 pb37, silver gray. Kic is a technology company working to make reflow ovens smarter through thermal profiling, automation and. Therefore the max temperature in the curve should be set at solder temperature of the alloy. Solder profiles and oven parameters for the ecreflowmate. Kester solder the kester r562 is an organic acid, water soluble solder paste specifically designed for resistance to environmental extremes. The sn63 alloy conforms and exceeds the impurity requirements of jstd006 and all other relevant international standards.
Software demo downloads profiling before downloading your free temperature profiling and analysis demo software, you will be prompted to complete a brief form. Microsemi cmpg and our contractors evaluate products and their reflow classification. All profiling and oven setup tasks are automated for maximum efficiency. Profile viewer and explorer showhide screenshot profile explorer automatically stores downloaded profiles against the users product name, creating a chronological record of profiles for each product, allowing users to organise their profiles and providing process traceability. The convection heating of an oven is too slow to even approximate the prescribed profile. The melting temperature of the solder, the heat resistance of the components, and the characteristics of the pcb i. In case nxp semiconductors has tested the product, this documentation reflects the outcome of the analysis of the actually tested parts only. Page 2 of 6 technical data sheet sn63 pb37, 215d, rev. Software demo downloads profiling fluke process instruments. Reflow soldering profile setup and optimisation software. Standard solder paste reflow profile for kester paste. Thus, profile is an important factor to decide soldering defects. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder.
The use of a profiling software platform with a radically simplified operator interface offers. This is an example profile measured on an altera fineline bga device. Kic thermal profiling solutions buy kic profilers online from manncorp and improve product quality, product support, productivity, and your bottom line. Soldering will include information on acceptable and defective leadfree solder joints. Leadfree profile using leaded paste we assemble a pcb that includes an 8 converter modules mounted close together. The shown data is for devices with a package thickness bgacsp rework er example 2 practical case study the graph below shows a trace of a profile taken from under a 492 pbga on a pc motherboard where the thermocouple trace appears to be normal hitting the desired preheat, soak and reflow temperatures. Compuphase focuses on programming of applications, and on the design and production of programmable electronics. A free powerpoint ppt presentation displayed as a flash slide show on id. The stated profile applies to sn63 and sn62 alloys.
With insight software for reflow tracker collect temperature data for your spc statistical process control and show your reflow soldering process is in control, measured against the reflow. Match solder paste specifications and oven configurations to provide robust process profiles. The conveyor speed was 34 inches per minute and the nitrogen flow was 1500. At the heart of all solderstars profiling solutions lies the powerful and intuitive profile central software suite. This profile is designed for use with sn63 or sn62 and can serve as a general guideline in establishing a reflow profile. Reflow profiling for nextgeneration solder alloys kic thermal. The profile describes the ideal temperature curve of the top layer of the pcb. Wave soldering profile 25 c time temperature tp tp rampdown ts preheat first wave second wave all information hereunder is per nxp semiconductors best knowledge.
This oven had ten temperature zones for solder reflow. However, with the advent of surface mount technology smt, reflow soldering has expanded in the number of types and has been studied, refined and explored as never before. Solder profiles to be able to solder using a chamber oven like the ecreflowmate it is important to understand that. Once the predictor software suggested new oven settings, these were updated and a new profile was collected by sending the board and profiler through the oven again. Reflow soldering, like wave soldering, is not a new manufacturing process. From a solder paste point of view, it is correct that as temperature elevates, solder paste tends to become soft and can cause slumping and result in solder beads, bridging and other soldering defects if the first rampup is too steep andor flux formulation is incorrect. In this graphic, the red curve represents a sensor that floats above the pcb, the yellow curve is for the sensor the floats below the pcb, the green curve represent a sensor that. The form of reflow soldering process mainly is the profile, referring to the curve of temperature change over time which is tested on smt component. May 18, 2017 with insight software for reflow tracker collect temperature data for your spc statistical process control and show your reflow soldering process is in control, measured against the reflow.
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